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Material: Pure Copper Wire (T1, T2, T3; Oxygen-Free Copper TU0, TU1, TU2).Standard Mesh Sizes: 1 - 350 Mesh (Customizable for Special Specifications).Characteristics:Excellent signal shielding effect.Non-magnetic.Good ductility.Rapid heat transfer.Strong electrical conductivity.Good sound insulation
Material: Pure Copper Wire (T1, T2, T3; Oxygen-Free Copper TU0, TU1, TU2).
Standard Mesh Sizes: 1 - 350 Mesh (Customizable for Special Specifications).
Characteristics:
Excellent signal shielding effect.
Non-magnetic.
Good ductility.
Rapid heat transfer.
Strong electrical conductivity.
Good sound insulation properties.
Applications:
Electromagnetic interference shielding for electronic equipment.
Glass layer shielding.
Electromagnetic and signal shielding.
Heat sinks for electronic products.
Manufacturing of heat pipes and internal cooling components for vapor chambers (VC).
Electromagnetic interference shielding in power, information technology, machinery, aerospace, medical equipment, and military equipment.
Radiation protection for special facilities such as cable circuits and laboratory server rooms.
Sieving and filtration of gases, liquids, and solids.
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